| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is small in size and has high-density wiring by narrowing the line width of a wiring conductor and making the diameter of a through-hole conductor small. SOLUTION: A multilayer wiring board is constituted of a substrate 1, a multilayer wiring section 2 which is formed at least on one principal plane of the substrate 1 and is made by alternately locating a plurality of organic resin insulating layers 3a, 3b, 3c, a plurality of thin-film wiring conductors 4a, 4b, 4c in layers and connecting the thin-film wiring conductors 4a, 4b, 4c via through-hole conductors 9, located in the organic resin insulating layers 3a, 3b, 3c, and a capacitive element A, which is made by adding a dielectric filler having a relative permittivity of 20 or above in at least one organic resin insulating layer 3b and by letting that part be faced opposite the parts of the thin-film wiring conductors 4a, 4b, which are located on the upper and the lower face of the organic resin insulating layer 3b, including the dielectric filler, and which are electrically connected between the thin-film wiring conductors 4a and 4b. In this case, each of the organic resin insulating layers is formed of acid catalyst-type photosensitive epoxy resin.</p> |
