SYSTEM AND METHOD FOR THERMALLY MANIPULATING A COMBINATION OF A TOP AND BOTTOM SUBSTRATE BEFORE A CURING OPERATION
摘要
A system and method cures a combination of a top (6) and a bottom (6) substrate with a resin (8) disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device (1600) is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.