| 发明名称 | LED packages and manufacturing method thereof | ||
| 摘要 | A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages. | ||
| 申请公布号 | US9397277(B2) | 申请公布日期 | 2016.07.19 |
| 申请号 | US201414203766 | 申请日期 | 2014.03.11 |
| 申请人 | Lite-On Electronics (Guangzhou) Limited;Lite-On Technology Corp. | 发明人 | Lin Chen-Hsiu |
| 分类号 | H01L21/48;H01L33/60;H01L33/52;H01L33/36;H01L21/78;H01L33/00;H01L23/00;H01L25/16;H01L33/48 | 主分类号 | H01L21/48 |
| 代理机构 | Rosenberg, Klein & Lee | 代理人 | Rosenberg, Klein & Lee |
| 主权项 | 1. A method of manufacturing LED packages, comprising the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer correspondingly surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages. | ||
| 地址 | Guangzhou CN | ||