| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of efficiently carrying out flatening and purifying highly accurately by means of a compact device. SOLUTION: In this polishing device where the surface to be polished of a material to be polished and the polishing surface of a polishing table are mutually pressed to each other so as to perform polishing, while the circular shaped material to be polished and the polishing table are kept rotating, the device is provided with a primary polishing table, and the radius of the polishing table is set to be larger than the diameter of the surface to be polished, and with a secondary polishing table 42 where the radius R of a polishing surface is set to be smaller than the diameter 2r of a surface to be polished, but to be larger than its radius (r). |
