<p>A board structure and a package component in which a step of processing a resin part can be simplified are provided. A board structure (10) has a board (11), electronic parts (12) mounted along the board (11), and a resin part (13) covering the electronic parts (12) with resin and adhering to the board (11). A protrusion (18) is provided on the bottom face (12A) of an electronic part (12) in a position (17) where the protrusion (18) does not interfere with electric connections (15, 16) between the board (11) and the electronic part (12). The protrusion (18) protrudes toward the board (11).</p>
