| 摘要 |
PROBLEM TO BE SOLVED: To thin the outer form of a light-emitting element and that of a light- receiving element as much as possible and to miniaturize a module and a set, which incorporate them. SOLUTION: Semiconductor chips 23 and 24 exist as a light-emitting element and a light-receiving element. A resin sealing body 25 sealing them is formed of a material which is transparent to light. A groove 27 is formed on an area where light is emitted from the elements and an area where light is made incident on the element. A reflection face 26 is construed on the groove. Thus, light can be ejected and it can be made incident through a side E. The elements are sandwiched by a supporting substrate 21 and a mounting substrate 30. Optical noise is suppressed. A wiring is not installed on a layer below the resin sealing body. |
