| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device mounting structure that is excellent in shock resistance and mass productivity, and easy in repairing and reworking, and does not cause residues of an adhesive or the like to be left on a circuit board after repairing and does not cause stress in repairing to the utmost, and provide its manufacturing method and a method for peeling the semiconductor device. <P>SOLUTION: A semiconductor device mounting structure 10 has a structure having a semiconductor device 11 with an electrode 11c arranged on one principal plane 11b, a circuit board 13 having a substrate electrode 13a that is electrically connected to the electrode 11c of the semiconductor device 11 by solder bumps 12, and a curable resin 14 with a plurality of kinds of thermally expandable particles 15 with different expansion temperatures mixed between at least the side face 11a and the circuit board 13 of the semiconductor device 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
