| 摘要 |
PROBLEM TO BE SOLVED: To inspect a bonding processing state of a substrate to appropriately perform the bonding processing.SOLUTION: A bonding method includes: disposing an upper wafer, held on the bottom face of an upper chuck, to face a lower wafer held on the top face of a lower chuck (step S11); then, descending an actuator part to depress the center of the upper wafer and the center of the lower wafer, to make contacting (step S12); then, in a state that the center of the upper wafer contacts to the center of the lower, diffusing the bonding between the upper wafer and the lower wafer from the center to the periphery (step S13); then, suspending the vacuum drawing of the periphery of the upper wafer by the upper chuck (step S14); and then, bonding the upper wafer with the lower wafer (step S15). In steps S11-S15, the state of the bonding processing is inspected by the detection of a current value of a drive unit for a first lower chuck movement unit.SELECTED DRAWING: Figure 16 |
