发明名称 厚膜ポリイミド金属張積層体
摘要 Provided is a thick layer polyimide metal clad laminate, and more particularly, a thick layer polyimide metal clad laminate for producing a product with excellent process stability and superior dimensional stability. Specifically, the present invention is directed to providing a thick layer polyimide metal clad laminate, in which a polyimide laminate and a metal foil, which is on one side or both sides of the polyimide laminate, are attached by a lamination process, wherein the polyimide laminate includes a polyimide film and a thermoplastic polyimide layer formed on one side or both sides of the polyimide film, the polyimide film having an elongation of 30% or less, and a tensile modulus of 3GPa or more, which is measured by IPC-TM-650 (2.4.19) method, and a coefficient of thermal linear expansion (CTE) of 5 to 30ppm/?, which is calculated from 100 to 250?.
申请公布号 JP5973449(B2) 申请公布日期 2016.08.23
申请号 JP20130534820 申请日期 2011.10.19
申请人 エスケー イノベーション カンパニー リミテッド 发明人 キム ホ スブ;キム デ ニョウン;ジュン スン フン;ジョ ビュン ウク;キム ユン ド;チェ ウェオン ジュン
分类号 B32B15/088 主分类号 B32B15/088
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