发明名称 COOLING UNIT FOR FLAT-TYPE POWER SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To decrease thermal resistance between heat pipes for an increased thermal response speed by a method wherein a cooler heat-receiving block is constituted of a lamination of two electric contact pieces and insertion holes are provided in the electric contact pieces for the accommodation of the heat receiving sections of the heat pipes. CONSTITUTION:A flat electric contact surface 6 is provided, wherewith a semiconductor element goes into contact under pressure, on the external surface of electric contact pieces 1-1, 1-2. Groups of insertion holes 4-1-4-6 are positioned parallel in the electric contact pieces 1-1, 1-2 for the accommodation of the heat-receiving sections of heat pipes. A spacer piece 1-3 is in close contact with the electric contact pieces 1-1, 1-2 for the construction of a laminated heat-receiving block. Accordingly, with the electric contact pieces 1-1, 1-2 being small in weight and thickness, thermal resistance may be reduced between the electric contact surface 6 and heat pipes and between heat pipes.
申请公布号 JPS6214447(A) 申请公布日期 1987.01.23
申请号 JP19850152946 申请日期 1985.07.11
申请人 AKUTORONIKUSU KK 发明人 AKACHI HISATERU
分类号 H01L23/427;F28D15/02;H01L23/473 主分类号 H01L23/427
代理机构 代理人
主权项
地址