发明名称 ANTI-SURGE WIRE BONDING RECOGNIZING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent an IC during bonding from being broken by a surge voltage generated in a commercial AC powder supply system in a wire bonding recognizing device. SOLUTION: Output two ends of a signal generator (AC signal generator 12) for recognizing bonding are floated from ground and surge is input to a light emitting diode 4 of a photovoltage coupler 3 at the same potential at two ends maintaining surge not to develop between the two ends, a signal is reproduced and outputted to a photodiode 5 of the photovoltage coupler 3 by optical coupling, it is applied to a wire 7 and a signal on application is inputted to a bonding recognizing circuit 13 and usual bonding recognition is carried out hereinafter. Since electrical coupling is not generated between input and output of a photovoltage coupler, surge is not transmitted.
申请公布号 JPH11233570(A) 申请公布日期 1999.08.27
申请号 JP19980052868 申请日期 1998.02.18
申请人 KAIJO CORP 发明人 URA MASANAO
分类号 H01L21/60 主分类号 H01L21/60
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