| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in soldering heat resistance, heat resistance and adhesion, in particular capable of bonding at low temperatures of <=250 deg.C. SOLUTION: This adhesive composition essentially comprises (A) 100 pts.wt. of a soluble polyimide, (B) 1-100 pts.wt. of an epoxy compound having at least one epoxy ring in the molecule, and (C) 1-150 pts.wt. of a compound having at least two unsaturated double bonds.
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