发明名称 |
EXPOSED-DIE MOLD PACKAGE FOR A SENSOR AND METHOD FOR ENCAPSULATING A SENSOR THAT INTERACTS WITH THE ENVIRONMENT |
摘要 |
A method of encapsulating a sensor device includes providing at least one sensor device that has a sensor portion on a substrate. An exclusionary zone is formed above an upper surface of the sensor portion. An outer boundary is formed on or about the sensor device with the outer boundary encircling the exclusionary zone. A mold material is deposited into a volume defined in part by the sensor device, the exclusionary zone, and the outer boundary to encapsulate portions of the sensor device. The exclusionary zone in one embodiment is an inner boundary that is formed on the sensor portion. The inner boundary encircles a portion of the upper surface of the sensor portion. The exclusionary zone in another embodiment is a selectively removable material deposited on the upper surface of the sensor portion. The selectively removable material occupies a space above a portion of the upper surface. |
申请公布号 |
WO2016100621(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
WO2015US66293 |
申请日期 |
2015.12.17 |
申请人 |
ROBERT BOSCH GMBH;FEYH, ANDO;O'BRIEN, GARY |
发明人 |
FEYH, ANDO;O'BRIEN, GARY |
分类号 |
H01L25/065;H01L23/28 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|