| 摘要 |
This electronic device is provided with: a resin substrate (10) obtained by forming, in an insulating resin, wiring (10a) provided with a conductive member; a heat-generation element (21) which is a circuit element mounted to one surface (S1) of the resin substrate, and which generates heat as a result of operating; and a sealing resin (40) which is provided to the one surface, and which seals the heat-generation element. The opposite surface (S2) to the sealing-resin surface in contact with the one surface is mounted and thermally connected to a heat-dissipation member. The resin substrate and the sealing resin each have a curved shape forming a protrusion towards the opposite surface side when the respective peripheral temperatures of the resin substrate and the sealing resin are at room temperature, and each have a linear expansion coefficient capable of maintaining, even when the peripheral temperatures are higher than room temperature, the curved shape forming the protrusion towards the opposite surface side. |
