| 摘要 |
PURPOSE:To improve the image drawing precision by a method wherein dividing marks are made to divide one side of chip region into unit belts and then image-drawn region dividing marks are made in the longitudinal direction to image-draw each unit belt in order making reference to the imaginary marks set up on each boundary line between unit belts by said two kinds of dividing marks. CONSTITUTION:A main deflection region 204 continuously image-draws patterns mounting on multiple chip regions 101 to detect marks by continuously shifting each unit belt 200A-200B. When the image-drawing of unit belt 200A is finished, a semiconductor wafer 100 is shifted by one unit belt length in the arrow 107 direction while the second unit belts are image-drawn when they are continuously shifted in the reverse to arrow 105 direction repeatedly 4 times. Region dividing marks 202A, 202B... are made along the side of unit belt 200A coming into contact with outside. Imaginary marks 300A, 300B... are set up on the boundary line 205 between the unit belts 200A and 200B from marks 202A, 202B... and 203A, 203B... to image-draw each image drawn regions 401, 402... of 200A. Likewise, when 200B is image-drawn, imaginary marks 300A, 300B are used on the other boundary line 206 to set up 500A, 500B... for image-drawing the image drawn regions 601, 602.... |
