| 摘要 |
<p>PURPOSE:To assure sticking processing even for semiconductor wafers that have been cracked or partly lacked by prompting an operator to perform operation through indications, one to set the semiconductor wafer onto a sticking cable, one to perform starting operation of block operation processing, and one to require to take out the workpiece after the processing has been completed to be taken out. CONSTITUTION:The title device comprises block operation control means B1 for control ling the whole block operation, wafer setting request display means B for requiring for an operating to set semiconductor wafer onto a sticking table, processing starting request indication means B4 for requesting the operation to start the block operation processing, work taking-out request indication means B5 for requesting for the operator to take out the workpiece after the block operation processing has been completed, and workpiece taking-out judgement means B6 for detecting that the workpiece has been taken out on the basis of a detection signal from a workpiece taking-out detector A6. Thus, a semiconductor wafer of a give shape can be automatically supplied and sticked as well as a semiconductor wafer of an irregular shape can be supplied manu ally and stuck by an operator.</p> |
