发明名称 LASER CUTTING DEVICE
摘要 PURPOSE:To cut an extra-thick object by measuring a distance to the surface of an object to be cut, a difference of a reflection factor caused by a material of a cross section, and depth of the cross section, and controlling a laser condensing lens system. CONSTITUTION:In a laser cutting device constituted of a laser oscillator 1, a partial reflecting mirror 6 and a condensing lens 4, an incident light detected by a detector 9 through the partial reflecting mirror 6, and a reflected light of a laser by an object cutting part detected by a detector 19 are inputted to a data processor 10, a reflection factor is derived, and depth of the cutting part is detected. Also, a position of the surface of an object to be cut is detected by an ultrasonic probe 7 by an ultrasonic measuring instrument 8, and a lens system controller inputs an output of the ultrasonic measuring instrument 8 and an output of the data processor 10 and outputs a focus feeding speed signal to the condensing lens system 4. In such a way, an extra-thick object is cut by laser light whose energy density is the highest.
申请公布号 JPH02307689(A) 申请公布日期 1990.12.20
申请号 JP19890128315 申请日期 1989.05.22
申请人 MITSUBISHI HEAVY IND LTD 发明人 TAURA MASAZUMI;NISHI AKIO;NODA SHOHEI;HORIE TETSUO
分类号 B23K26/00;B23K26/02;B23K26/03 主分类号 B23K26/00
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