METHOD AND ARRANGEMENT FOR BONDING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE OR FOR FINISHING A SEMICONDUCTOR/SUBSTRATE CONNECTION BY CONTACTLESS PRESSING

摘要

The invention is directed to a method wherein pressure is exerted onto a semiconductor surface by a chemically inert and non-solid medium. An opposite pressure is prevented from building up in an intermediate layer, for example, with the assistance of a seal. A connection between the semiconductor and the substrate occurs by pressure sintering or by diffusion welding. A contact between an active, inside region of the semiconductor and a plunger can be avoided since the plunger has a raised and annular outside region for sealing, and the actual pressing power is effected by the pressure medium via a bore situated in the plunger. This raised edge for sealing can also be situated on the semiconductor instead of being situated on the plunger. When a semiconductor component is extrusion-coated with a plastic melt, then this plastic melt itself can serve as a pressure medium.