| 摘要 |
<p>PURPOSE:To prevent position deviation of an element and a substrate, regarding a flip chip bonding method of an electronic circuit wherein the electrical connection parts of an electronic circuit element are brought into contact with the electric connection parts on the substrate via solder, and heated and bonded, and at the same time the element is mounted on the substrate. CONSTITUTION:Stud bumps 10 are formed on one out of an electronic circuit element 1 and a substrate 3. Guides 12 for fixing the stud bumps are formed in the other. The stud bumps 10 and the guides 12 are aligned and bonded.</p> |
