| 摘要 |
<p>PROBLEM TO BE SOLVED: To present a bonding pad part from being polished, for example, with the buff of mechanical polishing and from being lost by filling and forming a second insulation layer at the opening of a first insulation layer, protecting a bonding pad part and mechanically polishing the surface, and then exposing and developing the second insulation layer for elimination. SOLUTION: A liquid photosensitive insulation resin is applied to an insulation substrate 1 and a first insulation layer 6 is formed, and an opening 7 and a via hole 8 are formed on the surface of the insulation layer 6 other than those for forming the opening 7 and the via hole 8. Then, a photosensitive insulation resin is applied onto the substrate, and a second insulation layer 9 is filled into and formed at the opening 7 and is polished, for example, with a buff, thus eliminating the surface-curing film of the first insulation layer 6 and the second insulation layer 9. In this case, a pad 3 is projected by the second insulation layer 9, so that it cannot be polished. Then, a conductive circuit 11 is formed, and the second insulation layer 9 is eliminated and a bonding pad part 4 of the pad 3 is exposed, thus obtaining a multilayered printed wiring board 12 with the opening 7 and the via hole 8.</p> |
