POLYIMIDE FILM, ITS MANUFACTURING METHOD AND METALLIC WIRING PLATE USING THE SAME AS BASE

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film having an excellent high elastic modulus, low thermal expansion coefficient, alkali etching properties, and film-forming properties when the polyimide film is applied to a metallic wiring plate base for a flexible printing circuit applying a metallic wiring to its surface, CSP, BGA, or a TAB tape, and to provide a manufacturing method of the polyimide film, and a metallic wiring circuit plate using the film as a base. SOLUTION: The polyimide film is obtained by copolymerizing pyromellitic dianhydride, phenylenediamine, methylene-dianiline, and 3,4'-oxy-dianiline at a specified mole ratio thereof.