Solder contact reworking using a flux plate and squeegee

摘要

Solder contacts can be formed on the conductive sites of a substrate by placing preformed solder balls on the conductive sites and then reflowing the solder balls to bond the solder balls to the conductive sites. After formation of the solder contacts, solder flux can be applied to at least a portion of the solder contacts. The solder contacts can then be reflowed to substantially improve the adhesion of the solder contacts to the conductive sites and increase the shear strength of the solder contacts.