| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting efficiency of elements and facilitate electric insulation between the elements by providing a filter element electrically and mechanically connected to a first substrate via a second electrically conductive material, and providing a second substrate having external terminals electrically connected to a semiconductor device via a through hole and a first electrically conductive material. SOLUTION: A semiconductor device 11 and a surface acoustic wave filter element 5 are electrically and physically connected to both surfaces of a ceramic substrate 1 having a built-in shield electrode 8 using metal bumps 7a, 7b. A ceramic substrate 2 is mounted on the part of the lower surface of the ceramic substrate where the filter element 5 is not mounted. Input-output electrodes 9a, 9d, 9e are provided on both surfaces of the ceramic substrate 1. External terminals 3e, 3f, 3g, 3h provided on the lower surface of the ceramic substrate 2 are electrically connected to the semiconductor device 11 and to the surface acoustic wave filter element 5, via an electrically conductive pattern 12 and a through hole 6a provided on and in the ceramic substrate 1 and ceramic substrate 2. |
