发明名称 EPOXY-BASED RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy-based resin composition not only capable of reducing the amount of produced fluoride ions and improving resistance to electrolytic corrosion during thermal cationic polymerization but also having excellent low-temperature quick curability. <P>SOLUTION: The epoxy-based resin composition comprises an epoxy resin and a thermal cationic polymerization initiator. In the resin composition, a sulfonium borate complex represented by formula (1) (wherein, R<SB>1</SB>is an aralkyl group; R<SB>2</SB>is a lower alkyl group, with the proviso that R<SB>1</SB>is not a benzyl group when R<SB>2</SB>is a methyl group; X is a halogen atom; and n is an integer of 1-3) is used as the thermal cationic polymerization initiator. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008308596(A) 申请公布日期 2008.12.25
申请号 JP20070158283 申请日期 2007.06.15
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 ARAYA YOSHIHISA;YAMAMOTO JUN;AIZAKI RYOTA;HAYASHI NAOKI;KONISHI MISAO
分类号 C08G59/72;H01L21/52 主分类号 C08G59/72
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