SEMICONDUCTOR LASER MODULE AND ITS PRODUCTION

摘要

PROBLEM TO BE SOLVED: To make a precise alignment at the time of production of a semiconductor module possible to be well maintained even after packaging. SOLUTION: A ferrule 21 is fixed via supporting members 41, 43 to a sub- mount 30 loaded with a semiconductor laser 31 within the package 10 of the semiconductor laser module constituted by integrating the semiconductor laser 31 housed in the package 10 and an optical fiber 10 optically coupled to the semiconductor laser 31. The ferrule 21 is fixed to the supporting members 41, 43 at a first fixing point 21a near its front end and a second fixing point 21b more distant from the front end of the optical fiber 20 than the first fixing point 21a. These supporting members 41, 43 and the ferrule 21 are placed under the same temp. condition as the temp. condition of the semiconductor laser 31 without contact with the package 10.