| 摘要 |
<p>A hot melt adhesive composition containing at least one component which, on action of microwaves on the dry hot melt adhesive composition, leads to an increased heating-up rate compared with a corresponding dry hot melt adhesive composition without this component and thereby to a higher melting rate, contains as microwave-activable component electrically conductive substances whose electric conductivity is above that of the dry melt adhesive composition without this component. As electrically conductive substances there are proposed in particular carbon fibres, carbon black, graphite, antistats and metal particles, either alone or in use-specific mixtures. Hot melt adhesive coatings or self-supporting hot melt adhesive films containing these additions are up to 400 times faster to heat up with microwaves than conventional microwave-activable adhesives. This results in a distinct lowering in the consumption of electric energy in adhesive bonding by microwave activation or a corresponding increase in the rate of laying the material to be adhesively bonded. The novel hot melt adhesive composition is highly suitable for microwave-activated adhering of sheetlike substrates, in particular floor coverings, and because its activability is largely independent of its water content, in contradistinction to customary adhesives, it also provides the uniformity and reproducibility in activation and melting required for industrial uses and manufactures.</p> |
