SEMICONDUCTOR LASER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor laser module for shorter mounting time while the cost damage is less even if a laser diode chip is defective. SOLUTION: A package case 1a in which a laser diode chip 21 is housed comprises a metal base 2 on which the laser diode chip is mounted, and a frame 3 which is provided upright around the base 2 and encloses the laser diode chip 21. The laser diode chip 21 is fixed to the base 2 through a non-metal heat sink 20a which is substantially thinner than the base 2 so that the amount of a solder which changes the height of an exit surface of the laser diode 21 is reduced, resulting in significantly reduced variation in the height of exit surface.