| 摘要 |
A probe apparatus is provided with a number of space transformer segments that are fixated such that probe offset due to warping is kept to a minimum. In a first embodiment, the space transformer segments are permanently fixated. In a second embodiment the space transformer segments are included together with correspondingly shaped sheath segments in probe modules that may be individually removed from the probe apparatus for a selective maintenance. As a result a large number of chips may be tested simultaneously without reducing the operational cycle interval of the probe apparatus.
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