发明名称 |
PRINTING SOLDER INSPECTION DEVICE AND METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for forming image data using an image parameter common to a board, usually set at the inital stage of inspection to inspect the same and using an individual image parameter only with respect to a specific printing solder place to form image data for its inspection. <P>SOLUTION: An image processing means 5 is constituted so that the common image parameter stored in a parameter memory means 9 is used when it is clarified on the basis of position data that a printing solder place of measuring data ready to be processed is another printing solder place other than the specific printing solder place and the individual image parameter stored in an individual parameter storing regions 9a is used when it is a specific printing solder place. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005207950(A) |
申请公布日期 |
2005.08.04 |
申请号 |
JP20040016162 |
申请日期 |
2004.01.23 |
申请人 |
ANRITSU CORP |
发明人 |
JOMAN NAOYA;KIMURA TAKESHI;SUZUKI KATSUYUKI;KUSHIBUCHI TAKAO |
分类号 |
B41F33/14;G01B11/00;G01B11/02;G01N21/956;H05K3/34 |
主分类号 |
B41F33/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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