| 摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing method wherein no metal burr remains at the end of an electric wiring pattern in a circuit board where the electric wiring pattern composed of a single layer metal film or a multilayer metal film is formed on the board. SOLUTION: In the circuit board on which a single layer metal film or a multilayer metal film is formed, a resist film pattern is formed on the board using a photoengraving, and then a recess is formed at the lower part of a resist film end by wet-etching the single layer metal film or the multilayer metal film taking the resist film as a mask. Thereafter, the metal burr is prevented from remaining at the upper end of the single layer metal film or the multilayer metal film by selectively removing the single layer metal film or the multilayer metal film by ion milling while taking the resist film as a mask. COPYRIGHT: (C)2005,JPO&NCIPI
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