METHOD FOR MANUFACTURING THREE-DIMENSIONAL CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To ensure electrical insulation between a three-dimensional structure and a conductor circuit, without causing significant reduction in the radiation of a three-dimensional circuit substrate. SOLUTION: An insulating film 4 is formed on the surface of an insulating film 3, corresponding to a region irradiated with electromagnetic waves. Consequently, the thickness of an insulating film in the area irradiated with electromagnetic waves comes to be larger than the thickness of the insulating film of a region which is not irradiated with the electromagnetic waves. COPYRIGHT: (C)2008,JPO&INPIT