发明名称 PANEL FORMING APPARATUS
摘要 The purpose of the present invention is to provide a bonded panel forming device. The composition of the present invention comprises a cutting machine unit (110) forming a pair of side plate units (5) protruding further outwards than both side units of a core plate (2) of a second outer plate (4) on an other side by cutting both side units of the core plate (2); and a first outer plate (3) on one side of a bonded plate (1) wherein the first outer plate (3), the second outer plate (4), and a forming machine unit (220) forms locking pieces formed by bending both side plate units (5) of the second outer plate (4) of the bonded plate (1). The forming machine unit (220) comprises: a forming machine body (222) wherein a passage where the bonded plate (1) gone through the cutting machine unit (110) passes; a first forming unit forming the first locking piece (5a) by partly bending both side units of the second outer plate (4) of the bonded plate (1) in a direction across a surface of the first outer plate (3); a second forming unit forming the second locking piece (5b) by partly bending the side units in a direction parallel to a surface of the second outer plate (4) to be continued from an end of the first locking piece (5a); and a third forming unit forming the third locking piece (5c) by bending the rest of the parts of the side units remaining after forming the first locking piece (5a) and the second locking piece (5b) in a direction facing the first locking piece (5a).
申请公布号 KR101619906(B1) 申请公布日期 2016.05.23
申请号 KR20140153544 申请日期 2014.11.06
申请人 LEE, SEOUNG WON 发明人 LEE, SEOUNG WON
分类号 B21D35/00;B21D19/04;B21D28/02 主分类号 B21D35/00
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