发明名称 Vacuum processing system.
摘要 <p>A vacuum processing system of a type in which wafer cassettes each accomodating a plurality of wafers to be treated are supplied to deliver the wafers and wafer cassettes collecting the treated wafers are taken out. To enable the vacuum treatment, the vacuum processing system has a structure comprising: a plurality of wafer cassettes each being set in the atmospheric air and holding a plurality of wafers to be treated; at least one vacuum processing chamber for effecting vacuum treatment on the wafers; at least one load-lock chamber disposed between the cassettes and the vacuum processing chamber, the wafers being transferred into and out of vacuum atmosphere in the vacuum processing chamber through the load-lock chamber; and a wafer transfer device for transferring the wafers from each of the cassettes to the load-lock chamber and vice versa. The wafer cassettes are arranged on a substantially horizontal flat surface next to each other and each of the cassettes has two stationary positions, and the transference of the wafers from and into each the cassette is conducted at one of the stationary positions. This system can easily be adapted to automatization of production line and can reduce contamination of the products by dust and so forth, whereby a high production efficiency and yield can be attained. <IMAGE></p>
申请公布号 EP0488620(A1) 申请公布日期 1992.06.03
申请号 EP19910310822 申请日期 1991.11.25
申请人 HITACHI, LTD. 发明人 KATO, SHIGEKAZU;TAMURA, NAOYUKI;NISHIHATA, KOUJI;TSUBONE, TSUNEHIKO;ITOU, ATSUSHI
分类号 B01J3/02;B65G49/07;H01L21/677 主分类号 B01J3/02
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