| 摘要 |
The present invention relates to methods and means for using a layer of a radiation reflecting material as a thermal mirror when bonding a polymer with a high bonding temperature on a printed wiring board comprising polymers with a low working temperature. A copper foil is first applied (101) on the core-laminate. A layer of Benzocyclobuten (BCB) is then applied (102) on the copper layer. The BCB is bonded (103) by exposing the BCB to infrared radiation which radiates on and through the BCB. The infrared radiation that radiates through the BCB strikes the copper layer which reflects the radiation back into the BCB. This prevents the core-laminate, arranged under the copper layer, from heating. The copper layer acts as a "thermal mirror" and the radiation which is reflected back into the BCB generates some additional heat in the BCB. |
