| 摘要 |
PROBLEM TO BE SOLVED: To provide contact structure and a method for a burn-in test after mounted, as to a wafer level package (WLP) or the like. SOLUTION: This contact structure of the present invention has a printed circuit board, solder joining parts fixed onto the printed circuit board, and a fixed plate. The solder joining parts are fixed onto the printed circuit board, and have a plurality of contact metal springs connected to respective contact metal balls. The fixed plate is positioned between the solder joining parts. Substantially constant pressure is maintained between the each contact metal ball and the each metal spring, by using a surface of the fixed plate contacting with a surface of the wafer level package. COPYRIGHT: (C)2005,JPO&NCIPI
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