HEAT DISSIPATION DEVICE

摘要

A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.

主权项

1. A heat dissipation device comprising:
a base, the base defining a recess at a bottom surface thereof; a fin assembly mounted on a top surface of the base; a heat absorber arranged at a bottom surface of the base and embedded in the recess, a fixing plate being positioned on the bottom surface to cover the recess and define a sealed/airtight cavity between the fixing plate and the base, a top end of the heat absorber being received in the sealed/airtight cavity and a bottom end of the heat absorber extending through the fixing plate to expose out of the sealed/airtight cavity, a flexible sheet being totally received on the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.