发明名称 |
CERAMIC PLATE FOR SEMICONDUCTOR PRODUCING/INSPECTING APPARATUS |
摘要 |
A ceramic plate for a semiconductor producing/inspecting apparatus in which the ceramic plate is prevented from warping and a semiconductor wafer mounted on the ceramic plate can be protected against damage due to warp of the ceramic plate A semiconductor wafer is mounted on the ceramic plate for a semiconductor producing/inspecting apparatus or is held at a constant distance from the surface of the ceramic plate. The ceramic plate is characterized in that it has the surface roughness Rmax=0.1-250 mu m measured in compliance with the JIS R 0601, and the surface roughness of the wafer mounting/holding face is equal to that of the opposite face or the difference there between is within 50%. |
申请公布号 |
WO02091457(A1) |
申请公布日期 |
2002.11.14 |
申请号 |
WO2001JP03470 |
申请日期 |
2001.04.23 |
申请人 |
IBIDEN CO., LTD.;ITO, YASUTAKA;HIRAMATSU, YASUJI |
发明人 |
ITO, YASUTAKA;HIRAMATSU, YASUJI |
分类号 |
H01L21/00;H01L21/66;H01L21/68;H01L21/683;H05B3/14 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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