| 摘要 |
A high-density storage device has a housing and a memory and controller assembly. The housing has a plug part and a socket part receiving the plug part of other high-density storage device. The memory and controller assembly is mounted in the housing and has a circuit board, a source controller integrated circuit and a memory integrated circuit. The circuit board has an upper surface and a bottom surface. The source controller integrated circuit is mounted on the bottom surface. The memory integrated circuit is mounted on the bottom surface of the circuit board. Because the source controller integrated circuit and the memory integrated circuit are mounted on the same side of the circuit board, so high-density storage device has a reduced size. Furthermore, the socket part may connect with another high-density storage devices.
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