发明名称 |
SUBSTRATE TRANSPOTING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS WITH IT |
摘要 |
<p>A substrate transfer apparatus and a CMP apparatus having the same are provided to automatically turn over a substrate when the substrate is transferred from a polishing section to a cleaning section. A support member(110) has a support surface(112) for supporting a surface of a substrate which is to be processed. The substrate supported by the support surface is held by a release prevention member(114) having a stepped portion(114a) and a driving clamp(114b). The stepped portion protrudes from a front end of the support surface, and the driving clamp protrudes from a rear end of the support surface. The support member is rotated by a driving unit(120) to turn over the substrate supported by the support surface. The support member has a driving shaft(122) coupled to a rear end of the support member and a guide part(134) for guiding reciprocating motion of the driving unit.</p> |
申请公布号 |
KR20070095702(A) |
申请公布日期 |
2007.10.01 |
申请号 |
KR20060026225 |
申请日期 |
2006.03.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, MYUNG JAE |
分类号 |
H01L21/304;H01L21/677 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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