发明名称 SUBSTRATE TRANSPOTING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS WITH IT
摘要 <p>A substrate transfer apparatus and a CMP apparatus having the same are provided to automatically turn over a substrate when the substrate is transferred from a polishing section to a cleaning section. A support member(110) has a support surface(112) for supporting a surface of a substrate which is to be processed. The substrate supported by the support surface is held by a release prevention member(114) having a stepped portion(114a) and a driving clamp(114b). The stepped portion protrudes from a front end of the support surface, and the driving clamp protrudes from a rear end of the support surface. The support member is rotated by a driving unit(120) to turn over the substrate supported by the support surface. The support member has a driving shaft(122) coupled to a rear end of the support member and a guide part(134) for guiding reciprocating motion of the driving unit.</p>
申请公布号 KR20070095702(A) 申请公布日期 2007.10.01
申请号 KR20060026225 申请日期 2006.03.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, MYUNG JAE
分类号 H01L21/304;H01L21/677 主分类号 H01L21/304
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