| 摘要 |
A lead-free copper base alloy comprising between about 2-10 wt.% tin; between about 2-10 wt.% zinc; between about 1-3 wt.% bismuth; between about .05-1 wt.% phosphorous, and a balance being essentially copper is provided. The bismuth in this lead-free copper alloy is dispersed in a globular form throughout the grain boundaries of the alloy. The alloy may be economically produced by melting certain grades of scrap materials with bismuth and phosphorous followed by casting the resultant molten bath into ingots or barstock. |
