发明名称 CHIP PARTS SUPPLYING APPARATUS
摘要 PROBLEM TO BE SOLVED: To assure supply of parts by eliminating possibility for rejection of drop of chip parts because drop of chip parts in the upper and lower conduits are rejected due to chip and electrostatic electricity generated when mixed dust and chip parts are rubbed in the structure where the chip parts drop with its self-weight in the upper and lower conduits. SOLUTION: A direction converting mechanism 30 is provided with an upper/ lower conduit 23 in the upper side and an exhaust conduit 53 in the lower side. A chip part 15 detected with the front/rear surface detection sensor 7 is fetched and its rotating direction is selected to the lateral direction. An injection path 59 is connected in the left side and lateral conduits 60, 61 are connected in the right side. An injection path 50 is provided for injection in the course of the upper/lower conduit 23 because it is branched in the course of the injection path 59 and when pressured air is supplied to the injection path 5, chip part is pushed out to the lateral conduits 60, 61 from the direction converting mechanism 30 and thereby vapor is injected to the upper/lower conduit 23 from the injection path 50 to protect the chip part 15 from drop thereof.
申请公布号 JP2000208991(A) 申请公布日期 2000.07.28
申请号 JP19990010388 申请日期 1999.01.19
申请人 TDK CORP 发明人 KIN TSUKASA;WATABE AKIRA
分类号 H05K13/02 主分类号 H05K13/02
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