| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Fe-P-based copper alloy plate in which increased strength and excellent heat resistance are made consistent. SOLUTION: The Cu-Fe-P-based copper alloy plate having a relatively reduced Fe content and suitable as the stock for a lead frame for a semiconductor device has a texture where the ratio between the X-ray diffraction intensity I(200) from the (200) plane and the X-ray diffraction intensity I(220) from the (220) plane in the plate surface, I(200)/I(220) is≤0.3. In this way, its strength is made high, and its heat resistance is improved. COPYRIGHT: (C)2008,JPO&INPIT
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