发明名称 Method for Repairing a Component
摘要 <p>A layer (10) is applied to thicken the worn (eroded, corroded) wall of the substrate (4). Internal stresses are produced in the layer by plastic deformation. The layer (10) is then heat treated (+T) to convert it into a layer (10'') with a coarse grain structure. The internal stresses are produced by ball peening (16) and/or laser irradiation. Heat treatment of the layer (10') containing internal stresses, is by solution annealing at the solution annealing temperature appropriate to the substrate (4), or the material of the layer. The layer material corresponds with, or resembles, that of the substrate. A MCrAlX alloy is used for the layer. The grain size of the layer, before introduction of the internal stresses and before heat treatment, is at least 10 x smaller, and preferably 100 x smaller than that of the substrate. Following heat treatment, the grain size of the layer (10'') is in the millimeter range, especially being ca. 1 mm.</p>
申请公布号 EP1816316(B1) 申请公布日期 2009.01.07
申请号 EP20060001466 申请日期 2006.01.24
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BIRKNER, JENS;ESSER, WINFRIED, DR.
分类号 F01D5/00;C23C4/18;C23C24/00 主分类号 F01D5/00
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