| 摘要 |
FIELD: packaging industry.SUBSTANCE: invention relates to detection of defects in multilayer packing material, having at least one conducting layer. Earthed conducting layer of multi-layer packing material is placed in close contact with said multilayer packing material, adjacent to said multilayer packing material or at specified distance from said multi-layer packing material. Voltage is applied to said electrode by increasing voltage from initial value to specified value. Applied voltage is high enough to cause defect breakthrough with its conversion to open hole. Defect is detected in packing material by recording dielectric breakdown between electrode and conducting layer of multi-layer packing material.EFFECT: higher safety of products in container made of multilayer packing material due to detection of weak points in layer of polymer.13 cl, 7 dwg |
