发明名称 PACKAGE METHOD OF SUBSTRATE AND PACKAGE STURCTURE
摘要 The present invention provides a package method of a substrate and a package structure. The method comprises: step 1, providing the substrate (1) and a package plate (3), and the package plate (3) comprises a spreading surface (31); step 2, forming at least one groove (311); step 3, spreading seal glue (50) to form the continuous frame (5), and a recess (51) is formed in the frame (5) corresponding to the groove (311); step 4, positioning underfill (70) inside an area surrounded by the frame (5); step 5, oppositely fitting the substrate (1) and the package plate (3), and an air outlet (20) is formed at a position of the recess (51) of the frame (5) between the substrate (1) and the package plate (3); step 6, extracting air between the substrate (1) and the package plate (3) through the air outlet (20); step 7, laminating the substrate (1) and the package plate (3); step 8, irradiating and solidifying the seal glue (50) and the underfill (70) with UV light.
申请公布号 US2016240597(A1) 申请公布日期 2016.08.18
申请号 US201414381986 申请日期 2014.07.14
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 CHEN Lindou;SHI Kai
分类号 H01L27/32;H01L21/02;H01L23/31;H01L21/56 主分类号 H01L27/32
代理机构 代理人
主权项 1. A package method of a substrate, comprising steps of: step 1, providing the substrate and a package plate, and the package plate comprises a spreading surface; step 2, forming at least one groove in a spreading path of a frame on the spreading surface of the package plate; step 3, spreading seal glue on the spreading surface of the package plate to form the continuous frame, and a recess is formed in the frame corresponding to the at least one groove; step 4, positioning underfill inside an area surrounded by the frame on the spreading surface of the package plate; step 5, oppositely fitting the substrate and the package plate, and an air outlet is formed at a position of the recess of the frame between the substrate and the package plate; step 6, extracting air between the substrate and the package plate through the air outlet; step 7, laminating the substrate and the package plate; step 8, irradiating and solidifying the seal glue and the underfill with UV light to accomplish packaging the substrate with the package plate.
地址 Guangdong CN