| 摘要 |
MICRO-SURFACE WELDING This invention relates to a method and apparatus for wire bonding a variety of metals in the interconnection of semiconductor chips to electronic package substrate circuitries. A pair of electrically conducting bonding tip members are provided which are electrically isolated from one another and which are constructed of a material having a high resistivity. The wire is positioned beneath the tip members and a load is applied to the members to force the wire against a land on the substrate. A voltage source is provided to apply a voltage between the tip members. Activitation of the voltage source results in current flow through the tips and through the wire, in series, causing heating of the tip members and of the section of wire beneath them. Diffusion bonding will initiate before a significant amount of oxidation has had time to occur. |
