| 摘要 |
A multifunctional card comprising a substrate having a semiconductor circuit, and a housing, made of an insulating material, for housing the substrate, wherein the housing comprises two pieces of housing halves to be fitted to contain the substrate therein, and a conductive member is arranged in the housing along a seam between the housing halves so as to surround the substrate and to be electrically connected to a ground portion of the substrate.
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