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经营范围
发明名称
METHOD FOR ETCHING WAFER
摘要
申请公布号
JPH06252127(A)
申请公布日期
1994.09.09
申请号
JP19930035222
申请日期
1993.02.24
申请人
SHARP CORP
发明人
SHIRAKI RYUZO;KIRIHARA TAKESHI
分类号
H01L21/30;H01L21/306;(IPC1-7):H01L21/306
主分类号
H01L21/30
代理机构
代理人
主权项
地址
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