SURFACE TREATMENT OF COPPER TO PREVENT MICROCRACKING IN FLEXIBLE CIRCUITS

摘要

In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 .mu.m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 .mu.m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.