| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size and cost of a semiconductor and enhance its strength of bonding to a mounting board by removing coupling bodies from the underside of the semiconductor device and individually separating connecting pieces. SOLUTION: A frame 10 has an island 11 to bond a semiconductor chip to be formed in the center, and a coupling body R extending from each corner through suspending leads 12 is formed so that the island 11 is encircled with the coupling bodies R. First connecting pieces 13 extending toward the island 11 are integrally formed on the coupling bodies R at substantially equal intervals, and second connecting pieces 14 extending outward from the coupling bodies R are formed. A semiconductor chip is bonded to the island 11 using bonding material and a resin sealing body is placed. Finally, the first and second connecting pieces 12 and 14 are individually separated. Thus, the overall size and cost of the semiconductor device are reduced and the strength of connection with a mounting board is enhanced. |
